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Component Spit Out Added Value Services PCB rework and X-Ray Inspection Pb Free and XRF Screening
Tru-Form Services
Component spit out Pb Free/XRF screening
  • Lead alignment
  • BGA reballing
  • Component inspection
  • Component sift/sort
  • Tape and reeling
  • Component baking
  • Dry packing
  • X-Ray flourescence screening for WEEE/RoHS and ELV
  • Terminal finish conversion on BGA's and QFP
    1.     Terminal finish from Pb-Free to Pb
    2.     Terminal finish from Pb to Pb-Free
  • Potential sources for conversion:
    Obsolete stock, last time buys, end of life products
  • Take from options for conversion
  • Consider for defence and aerospace
PCB rework/X-Ray inspection Added value services
  • BGA rework
  • QFP rework
  • X-Ray Inspection
  • Component harvesting
  • Ionic contamination testing
  • Special pad and track repairs
  • PCB revision changes
  • Component programming
  • Tape and reeling
  • Component baking
  • Dry packing
  • Component cropping
  • Component forming

Tru-Form is recognised as a specialist within the field of attrition management and component enhancement.

Working alongside many leading names in the electronics community Tru-Form consistently provides effective solutions to assist reductions in their production costs.

 
 
 
 
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