Tru-Form
offers a suite of component-based services that are focused
towards supporting efficient manufacturing practice.
Component
Programming
Majority of package and technology styles handled including:
PIC’s
FPGA’s
Memory
Baking
and Dry Packing
Component baking and Dry packing in line with manufacturer
guidelines for all moisture sensitive components.
Tape
and Reeling
Tape and Reeling available for both Volume scheduled
requirements and Component Spit Out.
Special non-standard tapes can be arranged for odd form
components.
Cropping
and Forming
Components cropped formed and packaged ready for use in
assembly.
Tape and Reeling available for larger quantities.
Special packaging available for bench and batch build.
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