| Tru-Form
has the capability to change the terminal finish on BGA and
QFP components in line with RoHS directive 2002/95/EC as defined
by Jedec Standard JESD97.
Also
capable of non-destructive analysis and verification in line
with RoHS directive.
X-Ray Fluorescence Testing for WEEE/RoHS and ELV European
Directives.
Options for conversion include:
- Terminal
finish from Pb-Free to Pb
- Terminal
finish from Pb to Pb-Free
Stock
holding considerations for conversion:
- Last
time buys
- Obsolete
stock
- End
of Life Product
Other
complimentary services include:
- Double
dip for gold leaded devices (de-golding)
- Lead
forming and lead alignment
- Component
harvesting from assembled board
XRF
Screening
Non
destructive analysis of electronic equipment and components
for
banned and restrictive use substances. Testing and verification
for compliance to RoHS, WEEE, and EVL.
| Pb |
Lead |
Limit
1000 ppm |
| Hg |
Mercury |
Limit
1000 ppm |
| Cr
V1 |
Hexa-valent
chromium |
Limit
1000 ppm |
| PBB |
Polybrominated
biphenyls |
Limit
1000 ppm |
| PBE |
Polybrominated
diphenyl ethers |
Limit
1000 ppm |
| Cd |
Cadmium |
Limit
100 ppm |
RoHS:
Restriction of Hazardous Substances
WEE: Waste of Electrical and Electronic Equipment
ELV: End of Life Vehicles Directive
Screening
for concentrations of some substances above specified limits.
General
material testing including, Analysis of Plating Bath Solutions.
Tru-Form
has the capability to change the terminal finish on BGA and
QFP components in line with RoHS directive 2002/95/EC as defined
by Jedec Standard JESD97.
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