Traditionally
components that have been rejected at the surface mount placement
stage due to mechanical defects, have been scrapped at a total
loss financially to the manufacturer. At Tru-Form we have developed
a totally automated process which allows us to re-align the
legs of the component, bringing it back to original specification.
This service offers potentially huge savings to OEM and CEM
companies.
Automated
Realignment
Computer controlled correction of misaligned leads.
Majority of packages handled including QFP, SOIC, TSOP
and BQFP.
Including realignment of the leads on harvested components.
Automated
Inspection
Automated 100% three-dimensional inspection on all realigned
components including BGA’s.
Spit
out, BGA reballing and Lead Alignment
Valuable components recovered.
BGA’s Re-balled, inspected and packaged to a quality
standard suitable for machine placement.
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